共找到 150 條與 惡意軟件 相關的標準，共 10 頁
Graphical symbols — Public information symbols — Amendment 88: Symbol PI BP 010: Look to a point
ITU-T X.1205 – Supplement on guidelines for reducing malware in ICT networks (Study Group 17)
本文件適用于地下水資源監測工作，詳細規定了地下水采樣和質量控制的基本原則及操作程序
Technical Rule - Drafting Document DVGW W 112 (A)
本部分規定了移動支付業務系統的檢測內容和判定準則,包括業務系統的功能、性能、安全性、風險監控、文檔審核、外包管理和機構入網七個檢測類的檢測要求、操作規程及判定準則。本部分適用于指導檢測機構制定移動支付業務系統和機構入網的技術標準符合性、安全性檢測方案、執行檢測以及檢測結果符合性判定
China financial mobile payment.Test specifications.Part 6: Business system
This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with area array
Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Low-voltage switchgear and controlgear assemblies - Protection against electric shock - Protection against unintentional direct contact with hazardous live parts
Printed boards and printed board assemblies - Design and use -- Part 5-2: Attachment (land/joint) considerations - Discrete components (Endorsed by AENOR in January of 2004.)
Printed boards and printed board assemblies － Design and use － Part 5-2: Attachment(land/joint) considerations － Discrete components
本歐洲標準給出了用于通信和控制網絡基礎設施的對稱電纜、同軸電纜和光纖電纜的環境條件及安全方面
Communication cables. General considerations for the use of cables. Environmental conditions and safety aspects
Additive manufacturing - Non-destructive testing - Intentionally seeding flaws in metallic parts (ISO/ASTM TR 52906:2022); German version CEN ISO/ASTM TR 52906:2022
Additive manufacturing. Non-destructive testing. Intentionally seeding flaws in metallic parts
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003); German version EN 61188-5-2:2003
Overview of cybersecurity - Supplement on guidelines for reducing malware in ICT networks
This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of discrete electronic components. The purpose
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
Assessment of inadvertent initiation of bridge wire electro-explosive devices by radio-frequency radiation - Guide
