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DEBall mill 39
Ball mill 39, Total:59 items.
In the international standard classification, Ball mill 39 involves: Woodworking equipment, Construction equipment, Semiconductor devices, Transport, Industrial automation systems, Information sciences. Publishing, Equipment for processing of minerals, Iron and steel products, Mechanical structures for electronic equipment, Pharmaceutics, Power stations in general, Equipment for the glass and ceramics industries.
British Standards Institution (BSI), Ball mill 39
- BS 4361-39:1990 Woodworking machines - Nomenclature for circular sawing machines for building sites
European Committee for Electrotechnical Standardization（CENELEC）, Ball mill 39
- EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
- EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
Lithuanian Standards Office , Ball mill 39
- LST EN 60749-39-2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006)
ES-UNE, Ball mill 39
- UNE-EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006). (Endorsed by AENOR in November of 2006.)
- UNE-EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (Endorsed by Asociación Espa?ola de Normalización in March of 2022.)
SCC, Ball mill 39
- DIN EN IEC 60749-39:2023 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2021); German version EN IEC 60749-39:2022
- MIL MIL-S-20708/39A-1959 SYNCHRO, CONTROL TRANSFORMER, TYPE 19CTB4B (SUPERSEDING MIL-S-20708/39)
- MIL MIL-DTL-22442/39A-1998 CABLE ASSEMBLY, AIRCRAFT AUDIO EA-3B ADAPTER CABLE (SUPERSEDING MIL-DTL-22442/39) (NO S/S DOCUMENT)
- CEI EN 60749-39:2007 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solublity in organic materials used for semiconductor components
- CEI EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
- DANSK DS/EN 60749-39:2006 Semiconductor devices – Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
- DANSK DS/EN IEC 60749-39:2022 Semiconductor devices – Mechanical and climatic test methods – Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IN-BIS, Ball mill 39
- IS 4642-1968 Specifications for ball mills, ball mills and tube mills
German Institute for Standardization, Ball mill 39
- DIN EN IEC 60749-39:2023-10 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2021); German version EN IEC 60749-39:2022 / Note: DIN...
- DIN EN IEC 60749-39:2021 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 47/2652/CDV:2020); English version prEN IEC 60749-39:2020
- DIN EN 60749-39:2007 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006
- DIN EN 60749-39:2007-01 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006 / Note: To be r...
IX-ICAO, Ball mill 39
- ICAO AN 6-2 Amd 39-2021 Annex 6 - Operation of Aircraft - Part II - International General Aviation - Aeroplanes; Amendment 39
International Electrotechnical Commission (IEC), Ball mill 39
- IEC 60749-39:2021 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
- IEC 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
- IEC 60749-39:2021 RLV Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
Group Standards of the People's Republic of China, Ball mill 39
- T/CAMMT 39-2022 Technical specification for pneumatic-electronic converters for on-machine measurement of honin
Association Francaise de Normalisation, Ball mill 39
- NF C96-022-39*NF EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
- NF C96-022-39*NF EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
- NF EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: measurement of moisture diffusivity and water solubility in organic materials used in semiconductor components
RU-GOST R, Ball mill 39
- GOST 7.24-1990 System of standards on information, librarianship and publishing. Multilingual thesaurus for information retrieval. Composition, structure and basic requirements for development
- GOST 7524-1989 Grinding steel balls for ball mills. Specifications
- GOST 7524-2015 Grinding steel balls for ball mills. Specifications
- GOST 10141-1991 Rod and ball mills. General technical requirements
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Ball mill 39
VN-TCVN, Ball mill 39
Professional Standard - Machinery, Ball mill 39
GSO, Ball mill 39
- GSO IEC 60749-39:2014 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
- OS GSO IEC 60749-39:2014 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
RO-ASRO, Ball mill 39
Danish Standards Foundation, Ball mill 39
- DS/EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
機械電子工業(yè)部, Ball mill 39
工業(yè)和信息化部, Ball mill 39
Korean Agency for Technology and Standards (KATS), Ball mill 39
- KS C IEC 60749-39-2021 Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
- KS C IEC 60749-39:2006 Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
- KS E 5006-1981 Connical ball mill
- KS C IEC 60749-39-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
- KS C IEC 60749-39-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
- KS E 5007-1981 Great ball mill
Canadian General Standards Board （CGSB), Ball mill 39
Professional Standard - Electricity, Ball mill 39
- DL/T 681.1-2019 Coal-fired power plant coal mill wear parts specification part 1: Ball mill balls and liners
AT-OVE/ON, Ball mill 39
- OVE EN IEC 60749-39:2020 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 47/2652/CDV) (english version)
Indonesia Standards, Ball mill 39